Workshops

Workshop on 5G

Previous mobile technologies generations were mere evolutions from the preceding one; features and deployment were similar with only an increase in data rates. Transitioning to 5G is different and revolutionary as it promises extreme bandwidth capabilities, very low latency for never-envisaged applications, support of 20 billion+ IoT devices, and exploitation of sub 6GHz and over 24 GHz bands to cover in-building and dense outdoor coverage including massive MIMO support. Operators offering 5G will be able to compete in fiber for last mile and home broadband connectivity, taking fixed-mobile convergence to new levels.

All these characteristics come with drastic requirements on fronthaul and backhaul technologies, both from a capacity point of view and cost. Even the internal system architecture is challenged as density, energy consumption and footprint have to be improved compared to current generations of mobile networks.

Optical technologies are central to 5G realization and the goal of this workshop is to shed light and offer a primer on 5G architectures and required technologies to help realize the new capabilities. Many questions are central to this:

  1. How to reach 5G specification low-latency fronthaul and backhaul?
  2. What technology will win for 100G-400G per cell site offering?
  3. Can photonics integration be as pertinent in 5G RAN to solve density and power challenges as it is in hexascale datacenter switches?
  4. … and more

Without a doubt, the expert panel of the workshop will offer OIC attendants a clear view of what is coming, what is currently happening and what gaps exists to fulfill the 5G promise.

Panelists for the workshop discussion:
Sebastien Gareau, Ciena
Arzu Ozdogan-tackin, Intel


Workshop on Co-Packaged Optics

Co-packaged optics has been a topic of discussion for several years at Optical Interconnects. Previous panels have agreed the transition from pluggable to co-packaged optics is inevitable to solve the challenges of power, cost, and density facing next generation hyperscale data centers and super-computing. In this years’ workshop we will dig into some of the issues associated with taking the leap to co-packaged optics.

Topics covered in the workshop will include:

  • End-user system requirements
  • Thermal and cooling considerations
  • Packaging and assembly
  • Testing and yield
  • Supply-chain ecosystem

Panelists for the workshop discussion:
Jeff Cox, Microsoft
Calvin Cheung, ASE
Peter De Dobbelaere, Cisco
Mike Kelly, Amkor
Dan Kuchta, IBM
Thomas Lilljeberg, Intel