Workshop on Co-packaged Optics

Monday, 4 June 2018 | 3:45pm-6:00pm | Mesa Ballroom


OI 2017 in Santa Fe held two workshops: one on co-packaging of optics and one on 100 Gb/s signaling. In these workshops, industry experts from Ethernet switch, SerDes, as well as conventional and silicon photonics supplies convened to discuss the role of optics in continued bandwidth scaling and its associated challenges. The key observations from these two workshop were:

– SerDes rates will scale to 100 Gb/s/lane based on PAM4 with both OIF and IEEE 802.3 developing electrical interface to pluggable module
– Next generation pluggable module will support 100 Gb/s/lane but the electrical interface will consume substantial amounts of power
– The 25.6 Tb/s switch generation in 2020/2021 based on 256x100G is built though the extra power associated with SerDes may require liquid cooling
– Everyone agreed that the 51.2 Tb/s switch generation in 2022/2023 requires some form of co-packaged optics
– Everyone also agreed that even the 25.6 Tb/s switch generation will present an opportunity for co-packaged implementations if the manufacturing issues can be resolved and the total solution cost and power advantage

The OI 2018 Workshop on Co-packaged Optics further explores co-packaged solutions for the 25.6 Tb/s switch generation (where competing pluggable module based on OSFP, QSFP112, and QSFP-dd may exist) and beyond (where pluggable and on-board solutions will not be viable). Emphasis will be placed on high-volume manufacturing for conventional and silicon-photonic PICs, which is needed in the next 4 years to enable the 51.2 Tb/s generation of switches.


Tymon Barwicz, IBM, USA
Peter De Dobbelaere, Luxtera, USA
Frank Flens, Finisar, USA
Kobi Hasharoni, DustPhotonics, Israel
Katharine Schmidtke, Facebook, USA
Thomas Liljeberg, Intel
Koichi Takemerura, PETRA, Japan